Components

Vulnerability Matrix

Where the price shock lands hardest. Heatmap sums QoQ % moves by category; diverging bars rank current severity.

Wafer Map · Component × Quarter Severity

Each die is a category-quarter cell. Yield ramp encodes QoQ price severity: pass (≤0%) → fail (≥30%). Hover to inspect.

DRAMNANDGDDRHBMGPUQ1'24Q2'24Q3'24Q4'24Q1'25Q1'25Q2'25Q2'25Q3'25Q3'25Q4'25Q4'25Q1'26Q1'26Q2'26Q2'26Q3'26Q3'26Q3'26Q4'26Q1'27Q2'27Q3'27Q4'27LOT · SWX-2026Q3 · 300MM
NO DATA
PASS
MARGINAL
DEGRADED
FAIL
5×24 dies · hover to inspect
Source: Derived from price_pointsUpdated 2026-08-31

Heatmap · QoQ % Change by Category

Rows = component category, columns = quarter. Green = negative move; red = severe increase. Cells past the today marker are forecast.

CategoryQ1'24Q2'24Q3'24Q4'24Q1'25Q1'25Q2'25Q2'25Q3'25Q3'25Q4'25Q4'25Q1'26Q1'26Q2'26Q2'26Q3'26Q3'26Q3'26Q4'26Q1'27Q2'27Q3'27Q4'27
DRAM894151931231451572-4-8-10
NAND554101621201241271-5-8-9
GDDR101416212623151041892-5-8-9
HBM151514171715111075320-2-2
GPU
Scale:-5%+3%+10%+25%+45%+80%
Source: Derived from price_pointsUpdated 2026-08-31

Severity Ranking · Peak Price Shock

Ordered from least (stable) to worst (allocation-driven). Axis is peak observed % increase.

Source: component_vulnerability table

Detail Table

Bottleneck, severity, lead-time impact, recovery outlook.

CategoryBottleneckPeak %Recovery
DRAM / System RAMWafer reallocation to HBM (3x wafer footprint of DDR5)
+92%
Early 2028
NAND / SSD StorageFab cleanrooms shifted to DRAM; enterprise QLC demand
+58%
Mid-2027
VRAM / Consumer GPUsGDDR7 3GB module cost tripled; CoWoS constrained
+87%
2028 (RTX 60 delayed)
Motherboards & PassivesAI server VRM priority; high-grade MLCC shortage
+25%
Late 2027
Mainstream CPUsMature nodes stable; hit by demand drop
+5%
Recovered
Source: component_vulnerability table